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8 Layer Flex Circuit Boards
| Material: | AP8555 & AP8525 |
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| LF0110 Cover |
| Surface treatment: | ENIG 2U" |
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| Finish thickness: | 0.5mm |
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| Technology highlights: | Mixed laminated PCB |
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| Remark: | CLASS III |
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1 Layer Flex Circuit Boards
| Material: | FPC |
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| Surface treatment: | ENIG 2U" |
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| Finish thickness: | 0.1mm |
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| Width/space: | 6/4min |
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| Technology highlights: | Coil pattern circuit |
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| Remark: | IPC CLASS III |
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2 Layer Flex Circuit Boards
| Material: | AP9121R |
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| Surface treatment: | ENEPIG 2U" |
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| Finish thickness: | 0.2mm |
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| Solder mask: | TechniFlex LCL 1000F |
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| Coverlay: | FR0120 |
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| Remark: | IPC CLASS III |
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2 Layer Flex Circuit Boards
| Material: | LF9232+LF0310 |
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| Surface treatment: | HASL |
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| Finish thickness: | 0.3mm |
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| Width/space: | 10/10min |
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| Technology highlights: | Dupont Material, HASL |
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| Remark: | IPC CLASS III |
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4 Layer Flex Circuit Boards
| Material: | SF202+TAIFLEX FHT0525 |
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| Surface treatment: | ENIG 2U" |
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| Finish thickness: | 0.22mm |
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| Width/space: | 6/4min |
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| Technology highlights: | Vias fill with resin |
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| Min hole size: 0.1mm |
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1 Layer Flex Circuit Boards
| Material: | ITEQ + Taiflex Coverlay |
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| Surface treatment: | ENIG 2U" |
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| Finish thickness: | 0.16mm |
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| Technology highlights: | Top White Solder mask |
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| Top + Bottom Coverlay |
| Remark: | IPC CLASS III |
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2 Layer Flex Circuit Boards
| Material: | FPC |
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| Surface treatment: | HASL LF |
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| Finish thickness: | 0.2mm |
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| Copper thickness: | 2.5OZ |
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| Technology highligh: | 150 castellated holes |
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| Remark: | CLASS III |
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2 Layer Flex Circuit Boards
| Material: | FPC |
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| Surface treatment: | ENIG 2U" |
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| Finish thickness: | 0.2mm |
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| Width/space: | 11.8/9.7min |
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| Technology highligh: | FR4 only on panel frame |
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| Remark: | IPC CLASS III |
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