DRL IUb TXT

Drill

GTO

Top Overlay (Silkscreen)

GTS

Top Soldermask

GBS

Bottom Soldermask

GTL

Top Layer

GBL

Bottom Layer

BRO

Board

GKO

Keep Out Layer

GTP

Top Paste

GBP

Bottom Paste

GPT

Top Pad Master

GPB

Bottom Pad Master

PHO

Photoplotter

RPT

Report

GMx

Mechanical Layer X

GPx

Inner Plane Layer X

2

Please create a board outline / milling layer on a separate layer. Be sure to keep the right distance between the copper & milling line and the edge of the board so that it does not get damaged. Ideally, during the design process, add the Keep Out layer to help maintain the required distance;

3

When the impedance control is required, please create the appropriate table or description of requirements;

4

Please optimize the number of defined diameter of holes and drillings, which reduce production costs. Holes should be marked accordingly as metallized (PTH) and non-metallized (NPTH). In the case of buried or blind vias, separate drilling files should also be made for their range in the stackup (from which to which layers it applies, which layers it connects) and describe them accordingly. Please specify the tolerance as well;

5

Please create silkscreen/ overlay in a way that they do not overlap the pads - such descriptions will be cut in the production process.

If neither producer nor part number is specified in the BOM, there may be a problem with the completion, but it also extends the order delivery time, as this generates the need to consult the customer again,

Elements with the same value must be grouped and summed up,

When designing PCBs and choosing components, one should pay attention to whether the selected element is an element "recommended for new projects" or is "obsolete". In this case, there is a need to choose an equivalent which can extend the realization time,

The Pick and Place file will not replace the BOM.

The drawing should include the description/designations/designator of elements, e.g. R1, R2, C1, Q1, etc. This should be done in accordance with other attached documentation, e.g. BOM,

Descriptions shall be placed next to elements, not in the middle, because then the drawing becomes unreadable,

Marking the direction of location for elements such as e.g. diodes or a microcontroller is necessary. For example marking the position of the first pin or diode polarization with a dot.,

The inscriptions in the drawing should not be placed in a mirror image,

Drawings should be made separately for elements that are mounted at the top of the board and those at the bottom.

If you have PCB's in panel, please provide those files for the whole panel and not just for a single board,

If the SMD assembly is to be made on both sides of the PCB, files should be provided separately for elements that are mounted at the top of the board and those at the bottom.

Designator of a given element. Each element must be listed separately with its value, casing and exact position on the board: x [mm] and y [mm] and layer. Optionally, you can add a comment.